Packaging World’s Future Leaders in Packaging Scholarship was established in 2011 in conjunction with Leaders in Packaging – a print and online marketing program that enables suppliers to promote their innovation and expertise to the packaging community.
“Packaging World has been a long-time supporter of packaging education, via various association initiatives and editorially,” says PMMI Executive Vice President, Industry Outreach, Joe Angel. “We’re pleased to offer this annual scholarship as part of the Leaders in Packaging program.”
A portion of Leaders in Packaging revenue funds the Scholarship – awarded each year to an educational institution that prepares students for careers in packaging. Each recipient institution then selects a student or students to receive the funds to defray tuition and other education-related expenses in the next academic year.
To nominate a school for consideration, please contact Joe Angel.
2022 Scholarship Winner
Hennepin Technical College
The recipient of Packaging World’s 2021 Future Leaders in Packaging Scholarship is Hennepin Technical College.
2021 Scholarship Winner
Purdue University Northwest College of Technology
The recipient of Packaging World’s 2021 Future Leaders in Packaging Scholarship is Purdue University Northwest College of Technology.
2020 Scholarship Winner
University of Florida, Packaging Engineering Program
The recipient of Packaging World’s 2020 Future Leaders in Packaging Scholarship is the Packaging Engineering program at the University of Florida.
2019 Scholarship Winner
San José State University, Packaging Program
The recipient of Packaging World’s 2019 Future Leaders in Packaging Scholarship is the packaging program at San José State University.
2018 Scholarship Winner
RIT (Rochester Institute of Technology)
The recipient of Packaging World’s 2018 Future Leaders in Packaging Scholarship is the department of packaging science at RIT (Rochester Institute of Technology).
2017 Scholarship Winner
Rutgers
The recipient of Packaging World’s 2017 Future Leaders in Packaging Scholarship is the Packaging Engineering Program at Rutgers, New Jersey.
2016 Scholarship Winner
Cal poly
The recipient of Packaging World’s 2016 Future Leaders in Packaging Scholarship is the packaging program at Cal Poly, San Luis Obispo, CA.
2015 Scholarship Winner
Michigan State
The recipient of Packaging World’s 2015 Future Leaders in Packaging Scholarship is the packaging program at Michigan State, East Lansing, MI.
"...If it were not for generous organizations such as yours, my dream of studying packaging would not even be a possibility."
—Becca Uebele, 2015 Scholarship recipient
"I am currently in my junior year here at Michigan State University, dual majoring in Packaging Engineering and Supply Chain Management...This scholarship will allow me to be more focused on furthering my education rather than just the bills that come along with it."
—Jessica Kaczmarek, 2015 Scholarship recipient
2014 Scholarship Winner
Virginia Tech
The recipient of Packaging World’s 2014 Future Leaders in Packaging Scholarship is the Packaging Program at Virginia Tech, Blacksburg, VA.
"I have never felt more confident or excited about what my future career holds. I am hoping to pursue a career in the cosmetic industry, heading packaging design teams in large brand name companies."
—Alyssa M. Lopez, 2014 Scholarship recipient
"In the future I plan to pursue a career in the packaging industry with a dynamic and emergent company where there is an opportunity for personal growth and professional development."
—Megan Seabrook Stallings, 2014 Scholarship recipient
"I am actively involved with both packaging clubs on campus and have competed in a few design competitions as well during my time here. This scholarship has helped me tremendously this last semester in helping me pay off my final student loans."
—Michael Deck, 2014 Scholarship recipient
2013 Scholarship Winner
Missouri University of Science and Technology
The recipient of Packaging World’s 2013 Future Leaders in Packaging Scholarship is Missouri University of Science and Technology.
2012 Scholarship Winner
Clemson University
The recipient of Packaging World’s 2012 Future Leaders in Packaging Scholarship is Clemson University.
