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Scholarship supports next-gen packaging professionals

Packaging World and TricorBraun will donate a $2500 tuition scholarship to Missouri University of Science and Technology; The “Future Leaders in Packaging” scholarship is an annual award that is part of Summit Media Group’s Leadership in Packaging program.

Packaging World magazine and rigid packaging designer and supplier TricorBraun will salute the next generation of packaging professionals with the 2013 Future Leaders in Packaging Scholarship. Established to support and foster packaging education, the $2500 tuition award will be presented this year to an undergraduate student who is pursuing a packaging-related degree from Missouri University of Science and Technology (Rolla, Missouri).

The Future Leaders in Packaging Scholarship has been developed in conjunction with Packaging World's Leadership in Packaging program, a community-based print and online program that enables suppliers to promote their innovation and commitment to the packaging community. 

Based on TricorBraun’s participation in the 2012 Leadership in Packaging program and their outstanding effort to promote voter participation, they were given the honor of choosing the packaging school to receive this year’s scholarship and are being named with Packaging World as donors of the scholarship.

“Packaging World has been a long time supporter of packaging education,” says Packaging World Publisher Joe Angel. “We’re pleased to award a scholarship this year to Missouri University S&T and we’re honored to co-sponsor the award with a respected organization like TricorBraun.”

“All of us at TricorBraun were excited to be named the Promotional Leader for the 2012 Leadership in Packaging program and we appreciate the support from our customers that made this possible,” comments Suzie Fenton, TricorBraun’s Director of Marketing. “We’re especially pleased to choose Missouri S&T as the university to administer this year’s Future Leaders in Packaging Scholarship.”

Applicants for the 2013 award must be undergraduate degree candidates in the Engineering Management program. The university’s scholarship review committee will select the 2013 recipient or recipients. For more information, please contact Professor Stephen A. Raper in the Department of Engineering Management and Systems Engineering at Missouri University of Science and Technology.
 

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The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
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